Total 9 staff nurse job vacancies in Malaysia

1. In this position, the individual will be responsible for fully supporting the Department Manager on the development of the Company goals, strategy, and tactics.
2. The most important being the ability to work with the team to assure the good execution.
3. The individual will work with the team to fully support the company and department goals on yield, quality, and cost, utilization, productivity, and cycle time.
4. Knowledgeable in the Burn in Oven equipment and Burn in Board and Burn In Loader unloader.
5. Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
6. Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
7. Responsible for new material/component first articles inspection and final buyoff.
8. Continuous improvement on direct/indirect material cost down & yield enhancement program.
9. Ensure robustness of process control to meet yield & thru-put expectation.
10. Report any non-conformance/customer complains issue and develop/follow up the improvement actions.
11. Fully participate to resolve the issue thru teamwork and be the main coordinator for any internal/ external audit programs.

We are seeking a highly skilled and innovative staff engineer to lead our technical team in bringing new products to market within a dynamic environment. In this role, you will lead and contribute to the development and implementation of advanced test engineering strategies for our cutting-edge storage products. Below are the key responsibilities:

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Optimize Test Strategies: Design and execute efficient test plans, test time, yield, and quality to meet factory financial goals. Identify cost-effective testing methods through troubleshooting, validation, and continuous improvement.
• Lead and Collaborate on Engineering Solutions: Lead and implement innovative engineering solutions while collaborating with cross-functional teams to ensure project success under competitive timeline.
• Champion Innovation and Cost Efficiency: Collaboratively integrate advanced testing technologies, research, and adopt cost-saving solutions like Test Time Reduction (TTR) and new test platforms, driving CAPEX reduction. Continuously improve test programs and test infrastructure to enhance product quality and reliability.
• Technical Expertise and Support: Provide leadership in electrical failure analysis (EFA), exploring new test method/EFA technique to address RMAs, production, reliability, and DPPM improvement. Analyze test results and deliver reports to stakeholders with actionable insights for improvement.
• Technical Communication and Documentation: Develop and deliver clear, concise technical reports and documentation, including EFA, work instructions, test equipment guidelines, test reports, and specifications.
• NPI Support: Lead NPI projects, ensuring smooth transfer of test technology to mass production.
• Knowledge Sharing and Mentorship: Mentor junior engineers, promote best practices, and facilitate knowledge transfer through technical training.

To lead and manage RODI, IWWTP, Schedule Waste and STP operation and maintenance and ensure site operation complying to all legal requirements and inspections by local authorities are fully complied for Sarawak Plant 1 and Plant 2.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• To lead and manage a group of RODI, IWWTP, Schedule Waste and STP outsource team and ensure site operation complying to all legal requirements and inspections by local authorities are fully complied for Sarawak Plant 1 and Plant 2
• To supervise and monitor the performance of the contractors. To make sure WESTERN DIGITAL’s rules and regulations are obeyed by the contractors.
• Liaison with engineering / production personnel on the RODI quality, consumption and IWWTP discharge waste and volume.
• Management of reliability, quality, cost, and safety in RODI, IWWTP, Schedule Waste and STP systems.
• To troubleshoot and solve problems of RODI, IWWTP, Schedule Waste and STP related issues at plant and at production floor.
• To manage the RODI, IWWTP, Schedule Waste and STP calibration of all the related equipment / instruments and unit operation of the plant.
• To lead, manage and provide timely report for facility operation of RODI, IWWTP, Schedule Waste and STP monitoring parameters.
• To always ensure that IMS System or any other certifications compliance.
• To prepare, maintain and update the up-to-date documentation for RODI, IWWTP, Schedule Waste and STP.
• To plan, monitor and execute preventive maintenance for RODI, IWWTP, Schedule Waste and STP.
• To involve, coordinate and follow-up on upgrading projects. Involvement in the planning, installation, commissioning and ensuring the project being carried out according to the requirements spelled out.
• To optimize & improve RODI system operations resulting in lower utilities & chemical consumption.
• To carry out assessment & benchmark against JO water usage in effort to reduce overall SWK water withdrawn, leading to improve sustainability.
• Continuous improvement at all wastewater and related areas that will benefit in term of treatment system efficiency treated wastewater discharge stability (in term of quality) and waste reduction. Monitoring of treatment process performance & plant optimization.
• Breakdown Issue/crisis (upset) management at off working hours, weekend, and public holiday.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements.
• Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements.
• Develops new package and SMT process qualification programs.
• Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies.
• Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
• Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools.
• Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up.
• Acts as a liaison with suppliers/vendors.
• Maintains product quality while developing and introducing package cost reduction programs.
• Coordinates the introduction of new package processes into production.
• Using appropriate tools, performs integrity analysis of packages.

PME Specific Role Description includes the following but not limited to:

• SMT material and process development
• SMT AI/ML integration development
• SMT technology (material/process/metrology/equipment) pathfinding & roadmap
• Stencil design/development for new components
• DFM assessment and NUDD risk management
• Process-Material-Component-board-drive interactions
• DOE & Mechanical and Material Lab Tools & Failure Analysis knowledge
• Quality Tools: FMEA, 8D, DMAIC, IPC knowledge etc.
• Statistical Tools: Statistical analysis (JMP/Minitab), Green Belt/Black Belt certification
• Special engineering characterization & improvement projects
• Factory emergency taskforce support

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Provide mechanical simulations and solutions for edge-cutting flash memory products.
• Develop inhouse structural simulation automation platform based on commercial softwares (e.g. ANSYS, Abaqus).
• Predict and define structural risks and mechanisms using simulation tools for electronic packaging design, assembly and reliabilities.
• Material characterization for simulation accuracy and efficiency improvement  

• You will work as SSD (Solid State Drive) package integration engineer in packaging engineering group.
• Leads new SSD product development from concept design and qualification to mass production.
• Generate innovative product concepts and transform them into tangible, market-ready products.
• Work closely with global functional teams in US, India, South Korea, and Israel, review feasibility design drawings and propose design options.
• Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFX (Design for eXellence) analysis, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), as well as Cost and UPH (unit per hour) analysis, review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality.
• Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time.
• Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement and manage excursions.
• Lead new product from low volume to high volume production transition with yield and quality meeting goals.
• Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.
• Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production.

• Act as subject matter expert for the business with respect to labeling design, requirements, and implementation and labeling software and effectively collaborate on labeling changes.
• Ensure labeling compliance with quality management system (QMS), regulatory requirements and guidelines, standard operating procedures, and work instructions.
• Coordinate with cross functional team to develop strategies for continuous improvement of the labeling program and procedures (fool proof concept)
• Effectively manage labeling projects from ideation through completion.
• Improve from manual work flow to one piece flow concept to eliminate human error.

RESPONSIBILITIES:

• Design test plan, conduct validation testing on submitted drives, perform failure analysis, analyze test results (JMP), generate test reports, and provide engineering recommendation.
• Work independently or with cross functional teams to communicate schedules and assess readiness for volume production.
• Ensure products are validated in compliance with product specifications and customer performance requirements.
• Perform failure analysis or channel the failure to responsible groups for analysis where applicable.  
• Determine root cause and feedback to responsible groups to initiate corrective action. 
• Qualify new test and test system as required.
• Lead, coordinate and drives the team on closing critical issues, qualification, and projects.
• Actively looking for quality/efficiency improvement and test enhancement.
• Provide training to engineers / technicians.

• The Staff Engineer defines, develops and qualifies new semiconductor packages and maintains quality of existing packages. 
• Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements.  
• Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability.  
• Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions.  
• Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies.  
• Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes. Manages assembly yield improvement and package cost reduction programs.