Total 2 course director job vacancies in Engineering category in The United States of America

Key Responsibilities

Technically lead and/or execute unusually complex engineering projects and spearhead research and development of new technologies as appropriate

Develops and implements concepts for entire range of unusually complex product issues and engineering solutions

Problem identification and troubleshooting a wide range of unusually complex engineering and technology problems that have division wide potential implications

Interface with internal and external customers regarding unusually complex engineering issues and troubleshooting to solve customers High Value Problems (HVP) for the unit's product line

Specify or perform unusually complex engineering analysis

Specify the development of, design, or modify engineering layouts/schematics and/or detailed drawings/specifications of unusually complex scope

Generate product specifications. Define, coordinate, perform, and document engineering tests.

Specify and review engineering documentation and engineering processes

Functional Knowledge

• Recognized as “guru” or external expert in a function
• Demonstrates broad and comprehensive expertise in leading-edge theories, techniques and/or technologies within own field

Business Expertise

• Influences internal/external business and/or regulatory issues that have an impact on the business

Leadership

• Leads highly visible multidisciplinary project teams or initiatives; provides thought leadership

Problem Solving

• Proactively identifies and solves the most complex problems; uses ground-breaking methods to think beyond existing solutions 

Impact

• Impacts business direction through the development of innovative services or products

Interpersonal Skills

• Negotiates with senior management, customers, regulators or vendors to influence decisions

Qualifications

Education:

Bachelor's Degree

Skills

Certifications:

Languages:

Years of Experience:

10 - 15 Years

Work Experience:

Additional Information

Travel:

Yes, 10% of the Time

Relocation Eligible:

No

U.S. Salary Range:

$176,000.00 - $242,000.00

The salary offered to a selected candidate will be based on a number of factors including location and level and will vary depending on confirmed job-related knowledge, skills, and experience.  In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. 

Responsibilities

The successful candidate will be in Singapore as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging. The successful candidate will be responsible for:

• Developing new modules leveraging Applied Materials wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.

• File for IP on new patentable developments.

• Act as engineering expert in semiconductor packaging and help drive cross functional projects by working with engineers, managers, and directors/Senior directors across Applied Materials business units, including the packaging business unit.

• Help structure and maintain Applied Materials roadmap in Packaging modules and how it fits within advanced modules with the industry.

• Help design experiments to help improve packaging wiring to improve performance, by reducing RC delays and increasing wiring density in various dielectrics, including polymer dielectrics and deposited thin film dielectrics.

• Represent Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers, outside Applied.

• Define engineering plans, design DOEs, help characterize and create engineering reports for advanced packaging.

• Create roadmap committees for some packaging applications and help shepherd Applied Materials product portfolio.

Requirements

• Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent

• 10 years of experience in semiconductor packaging development and manufacturing

• Strong communication skills to be effective in dealing with Business Units, cross-functional teams, internal or external manufacturing and customer

• Lead project across organization and culture in a fast-paced environment

• Self-starter, team player and able to work independently with minimal supervision 

Qualifications

Education:

Bachelor's Degree

Skills

Certifications:

Languages:

Years of Experience:

10 - 15 Years

Work Experience:

Additional Information

Travel:

Yes, 20% of the Time

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.